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    Special Tape

    Special Tape
    Equipment Status
    Production Facilities
    Standard
    Process Q’ty
    (C-kit)    		 Capacity
    (Monthly)    		 Total Remarks
    Product.M/C Coating Machine 1 1 900,000㎡ 900,000㎡ PRINT/COATING(C/R)
    Coating Machine 2 1 900,000㎡ 900,000㎡ PRINT/COATING(C/R)
    Coating Machine 3 1 1,300,000㎡ 1,300,000㎡ PRINT/COATING(C/R)
    Coating Machine 5
    (Clean Room)    		 1 900,000㎡ 900,000㎡ MICRO/COMMA COATING (C/R)
    Cutting Machine 1 1 6,000 R/L 6,000 R/L Manual
    Cutting Machine 2~4 3 8,000 R/L 24,000 R/L Automation
    Cutting Machine 5 1 900 R/L 900 R/L Jumbo
    Slitting Machine 1 5,000 R/L 5,000 R/L
    Winding Machine 1
    Anal.M/C UTM 1 2kg/25kg
    Laminator 1
    Dry oven 2 0~250℃
    UV 조사기 1 100W
    Microscope 1 40X
    Press 1 500kg
    Production facilities
    Analysis equipment
    Peel Strength
    Standard
    Standard
    Test Plate - Si Mirror Wafer
    - SUS 430
    Specimen Size - 25mm X 150mm
    Test Condition - Temperature : 23 ± 2℃
    - Humidity : RH 55 ± 10%
    Test Speed - 300mm/min
    Tensile Strength / Elongation
    Standard
    Standard
    Specimen Size - 10mm X 150mm
    Test Condition - Temperature : 23 ±2℃
    - Humidity : RH 55 ±10%
    Test Speed - 300mm/min