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    Special Tape

    Special Tape
    Heat Release Tape
  • Cutting and processing of ceramic. wafer dicng, simple exfoliation, and simplified process is possible.
    • Special features
    High Adhesion Strength keeps your work-piece in place. ( have not Chip flying)
    Easy release by heating
    Almost no residue after release at optimum temperature
    Composition
    Standard specification
    Standard specification
    Model Foaming /max ℃ Base Film
    (PET)    		 Thickness
    (㎛)    		 Adhesion
    (gf/25mm)
    RP31N6 110~120℃ DoubleSide 222 550
    RP37D7 140~145℃ Single Side 136 820
    RP72E7 170~180℃ Double Side 176 780
    RP725W 170~180℃ Double Side 176 310
    EXAMPLE
    ※ MLCC
    Application area
    MLCC / Ceramics
    PCB / LAPPING use