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Special Tape
UV TAPE (DU Series)
- This product can minimize the amount of glue and the base film is environmental-friendly one as poly olenfin. During the dicing process, because Adherend is fixed firmly, we don't see any chip fly. According to the family of products, the adhesive strength is quite different and change of adhesive strength is possible in accordance with the surface of Adherend
- Special features
- High Adhesion Strength keeps your work-piece in place. ( have not Chip flying)
- Almost no residue after U.V Irradiation
- Easy release by U.V Irradiation
- Adhesive Strength is differ from its model type and adhesive strength could be increase depend on the surface condition of material
- Composition
- Standard specification
-
Standard specification
| Model |
Thickness(㎛) |
Adhesion(gf/25mm) |
| Base Film |
Adhesive |
Befor UV |
After UV |
| DU-9177 |
150±3
(PO) |
20±2 |
1200±20 |
25±20 |
| DU-9178 |
20±2 |
1500±20 |
25±20 |
| DU-390 |
80±3
(PO) |
10±2 |
400±20 |
10±20 |
| DU-390E |
10±2 |
200±20 |
10±20 |
| DU-130P |
100±3
(PET) |
10±2 |
2600±100 |
25±20 |
- EXAMPLE
- ※ Dicing
- Application area
- Semiconductor / LED DICING
- GLASS, PCB, Ceramics DICING
